ITW Dynatec introduces Simplicity hot melt adhesive

November 10th, 2016

Hendersonville, Tenn.-based bonding and sealing developer ITW Dynatec will unveil the latest version of its Dynamelt™ S Series adhesive supply unit (ASU) at Pack Expo 2016. It also will preview its recently developed Simplicity ASU product line. The compact Simplicity unit features single board control and ease of operation, eliminating the need for extensive or […]

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