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FlexTech Alliance Announces 3 New Development Agreements

Industry News | March 6, 2015 | By:

FlexTech Alliance, San Jose, Calif., has announced several development agreements in the field of flexible, printed electronics. The R&D agreements, which are primarily focused on project demonstrators, are a result of a 2014 FlexTech initiative, supported by the U.S. Army Research Laboratory in Adelphi, Md.

The awards were granted to:

1. PARC, a Xerox Company, to develop a digitally-fabricated hybrid electronic sensor platform on a flexible substrate that is easily customizable to multiple sensor types. The project will culminate in a demonstration for a structural health monitoring application based on printed strain sensors.

2. Clemson University to develop large-format, energy-harvesting arrays produced on an industrial scale via roll-to-roll printing processes.

3. Arizona State to demonstrate the world’s first electric field imaging blanket with a 4-inch diagonal array capturing the spatial electrical activity of circuitry.

All of the funded projects are being cost-shared by the recipients.

FlexTech Alliance focuses on growth, profitability and success throughout the manufacturing and distribution chain of flexible, printed electronics and displays. By facilitating collaboration among industry, government and academia, FlexTech Alliance develops solutions for advancing these technologies from R&D to commercialization.

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